DocumentCode
477149
Title
An efficient regularized neighborhood discriminant analysis through QR decomposition
Author
Cheng, Miao ; Fang, Bin ; Tang, Yuan-yan ; Wen, Jing
Author_Institution
Dept. of Comput. Sci., Chongqing Univ., Chongqing
Volume
1
fYear
2008
fDate
30-31 Aug. 2008
Firstpage
304
Lastpage
309
Abstract
Inspired by the concept of manifold learning, the discriminant embedding technologies aim to exploit low dimensional discriminant manifold structure in the high dimensional space for dimension reduction and classification. However, such graph embedding framework based techniques usually suffer from the large complexity and small sample size (SSS) problem. To address the problem, we reformulate the Laplacian matrix and propose a regularized neighborhood discriminant analysis method, namely RNDA, to discover the local discriminant information, which follows similar approach to regularized LDA. Compared with other discriminant embedding techniques, RNDA achieves efficiency by employing the QR decomposition as a pre-step. Experiments on face databases are presented to show the outstanding performance of the proposed method.
Keywords
Laplace transforms; data reduction; graph theory; learning (artificial intelligence); matrix algebra; pattern classification; sampling methods; statistical analysis; Laplacian matrix; QR decomposition; dimension classification; dimension reduction; discriminant embedded technology; graph embedding framework; high dimensional space; low dimensional discriminant manifold structure; manifold learning; regularized neighborhood discriminant analysis; small sample size problem; Face recognition; Feature extraction; Laplace equations; Linear discriminant analysis; Manifolds; Matrix decomposition; Pattern analysis; Pattern recognition; Principal component analysis; Wavelet analysis; Dimension reduction; Discriminant Embedding; QR decomposition; Regularized LDA;
fLanguage
English
Publisher
ieee
Conference_Titel
Wavelet Analysis and Pattern Recognition, 2008. ICWAPR '08. International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-2238-8
Electronic_ISBN
978-1-4244-2239-5
Type
conf
DOI
10.1109/ICWAPR.2008.4635794
Filename
4635794
Link To Document