Predictive Application of PIDF and PPC for Interconnects´ Crosstalk, TSV, and LER Issues in UDSM ICs and Nano-Systems

Author

Atghiaee, Ahmad ; Masoumi, Nasser ; Zarkesh-Ha, Payman ; Mehri, Milad

Author_Institution

Sch. of Electr. & Comput. Eng., Univ. of Tehran, Tehran, Iran

Volume

22

Issue

2

fYear

2014

fDate

Feb. 2014

Firstpage

438

Lastpage

443

Abstract

In this brief, a novel methodology for the prediction of three phenomena related to the interconnects in VLSI circuits will be presented. First, the power (including crosstalk-induced power) prediction for ultradeep submicron ICs and nano systems is proposed. The novelty of the method for crosstalk prediction is deduced by employing a polynomial progressive calibration. Second, as a part of this methodology, we present a new solution for power prediction of through-silicon-vias.

Keywords

VLSI; calibration; crosstalk; integrated circuit interconnections; nanoelectronics; polynomials; three-dimensional integrated circuits; LER; PIDF; PPC; TSV; UDSM ICs; VLSI circuits; crosstalk-induced power prediction method; interconnect crosstalk; nanosystems; polynomial progressive calibration; predictive interconnect density function; through-silicon-vias; ultradeep submicron ICs; Crosstalk-induced power; interconnect density functions; polynomial progressive calibration (PPC); power prediction; predictive methodologies; through-silicon-via (TSV);

fLanguage

English

Journal_Title

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

Publisher

ieee

ISSN

1063-8210

Type

jour

DOI

10.1109/TVLSI.2013.2243849

Filename

6513287