• DocumentCode
    478858
  • Title

    Influence of contact contour on breakdown behaviors in vacuum under uniform field

  • Author

    Liu, Zhiyuan ; Cheng, Shaoyong ; Zhang, Yingyao ; Yang, Lanjun ; Geng, Yingsan ; Wang, Jimei

  • Author_Institution
    State Key Lab. of Electr. Insulation & Power Equip., Xi´´an Jiaotong Univ., Xi´´an
  • Volume
    1
  • fYear
    2008
  • fDate
    15-19 Sept. 2008
  • Firstpage
    25
  • Lastpage
    28
  • Abstract
    We experimentally investigated influence of contact contour on breakdown characteristics in vacuum under uniform field. Four vacuum interrupters are used and their contact contours are designed to obtain effective area Seff from 211 mm2 to 550 mm2. The contact parameters are contact diameter -42.76 mm, contact gap - 6 mm, contact thickness 16 mm and contact material -CuCr50. Basic impulse level (BIL) voltage (1.2times50 mus) voltage is applied. The experimental results show that 50% breakdown voltage U 50 decrease 11% from 248 kV to 221 kV when effective area increase from 211 mm2 to 550 mm2. O n the other hand, the effective area Seff has a significant influence on conditioning process. The larger the effective area, the slower the conditioning process.
  • Keywords
    copper compounds; electric breakdown; electrical contacts; vacuum interrupters; CuCr; breakdown behaviors; breakdown voltage; conditioning process; contact contour; contact parameters; impulse level voltage; size 16 mm; size 42.76 mm; uniform field; vacuum interrupters; voltage 248 kV to 221 kV; Conductivity; Contacts; Dielectrics and electrical insulation; Electric breakdown; Interrupters; Laboratories; Optimization methods; Rubber; Silicon; Vacuum breakdown;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum, 2008. ISDEIV 2008. 23rd International Symposium on
  • Conference_Location
    Bucharest
  • ISSN
    1093-2941
  • Print_ISBN
    978-973-755-382-9
  • Electronic_ISBN
    1093-2941
  • Type

    conf

  • DOI
    10.1109/DEIV.2008.4676708
  • Filename
    4676708