DocumentCode
479552
Title
Research on product innovation mode based on modularity theory: A case study on Haier product innovation
Author
Ouyang, Taohua ; Li, Jing ; Chen, Zhanfeng
Author_Institution
Renmin Univ. of China, Beijing
Volume
1
fYear
2008
fDate
12-15 Oct. 2008
Firstpage
250
Lastpage
255
Abstract
Based on the modularity theory and taking Haier PTOI0 technology water heater as the case, the paper researches Chinese enterprises, product innovation mode and features, and reveals how Chinese enterprises product innovation capability forms and what competitiveness it has. Haier builds the capacity of internal modularity through combining model manager system, module manager system with marketization mechanism, and builds the capacity of external modularity through integrating upstream suppliers\´ core technologies on the open product innovation platform. The mode of " internal modularity + external modularity" exerts obvious and positive effects on product innovation of Haier: shortening life cycle of product innovation, reducing development cost, promoting diversification, enhancing reliability, increasing market competitive capability. Meanwhile, the mode also possibly hinders the systematic innovation and makes new product imitated easily, leading enterprises to fall into the situation of homogenization competition. The mode this paper discusses may have significant reference value for Chinese enterprise to strengthen product innovation capability and product competitiveness.
Keywords
innovation management; product development; product life cycle management; China; Haier product innovation; homogenization competition; modularity theory; product competitiveness; product cycle life; Innovation management; Paper technology; Product development; Product safety; Production; Resistance heating; Standards development; Technological innovation; Technology management; Water heating; internal and external modularity; product Innovation;
fLanguage
English
Publisher
ieee
Conference_Titel
Service Operations and Logistics, and Informatics, 2008. IEEE/SOLI 2008. IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2012-4
Electronic_ISBN
978-1-4244-2013-1
Type
conf
DOI
10.1109/SOLI.2008.4686400
Filename
4686400
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