Title :
A Polysilicon Microhemispherical Resonating Gyroscope
Author :
Peng Shao ; Mayberry, Curtis L. ; Xin Gao ; Tavassoli, Vahid ; Ayazi, Farrokh
Author_Institution :
Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This letter reports, for the first time, an integrated polysilicon microhemispherical resonating gyroscope (μHRG) with selfaligned drive, sense, and tuning electrodes, all fabricated using a single wafer process. The polysilicon hemispherical shell is 700 nm in thickness and 1.2 mm in diameter, resulting in a 1:3000 aspect ratio three-dimensional (3-D) microstructure. The quality factor of the wineglass mode is measured to be 8500 at 6.7 kHz with an as-fabricated frequency mismatch of 105 Hz between the two m = 2 degenerate modes. The modes are electrostatically matched and aligned using the tuning electrodes with a resulting mode-matched quality factor of 11100. Initial characterization of the sensitivity of the μHRG shows a scale factor of 4.4 mV/o/s.
Keywords :
Q-factor; elemental semiconductors; glass; gyroscopes; micromechanical resonators; mode matching; silicon; 1:3000 aspect ratio; 3D microstructure; degenerate mode; electrostatic mode matching; frequency 105 Hz; frequency 6.7 kHz; frequency mismatching; integrated polysilicon μHRG; microhemispherical resonating gyroscope; mode matched quality factor; polysilicon hemispherical shell; quality factor measurement; scale factor; self-aligned drive; size 1.2 mm; size 700 nm; tuning electrodes; wafer process; wineglass mode; Electrodes; Gyroscopes; Micromechanical devices; Q-factor; Resonant frequency; Sensitivity; Tuning; Gyroscopes; frequency mismatch; frequency mismatch.; hemispherical shell resonator; microelectromechanical system (MEMS); mode matching; quality factor;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2014.2327107