Title :
An Approximate Closed-Form Transfer Function Model for Diverse Differential Interconnects
Author :
Minsoo Choi ; Jae-Yoon Sim ; Hong-June Park ; Byungsub Kim
Author_Institution :
Dept. of Electr. Eng., Pohang Univ. of Sci. & Technol., Pohang, South Korea
Abstract :
This paper presents an approximate closed-form transfer function model for diverse differential interconnects. The proposed model is simple, intuitive, and can accurately describe various interconnects satisfying the validity conditions which theoretically bound the approximation error. The proposed model also provides a conceptual circuit representation by analogy with an equivalent circuit model of a single-ended interconnect. The model´s accuracy is verified by comparing calculated through- and crosstalk-transfer functions against w-element SPICE simulation results for various LC-dominant and RC-dominant interconnects. Our analysis also empirically verifies that the approximation error is bounded by the validity parameters. In addition, the computation time is improved by about 157 times compared to that of the previous numerical computation method built-in SPICE simulator. With the proposed channel model, designers can easily understand and analyze the behaviors of various differential interconnects without complex analysis.
Keywords :
equivalent circuits; integrated circuit interconnections; transfer functions; LC-dominant interconnects; RC-dominant interconnects; analogy; approximate closed-form transfer function model; approximation error; computation time; conceptual circuit representation; crosstalk-transfer functions; diverse differential interconnects; equivalent circuit model; numerical computation method; single-ended interconnect; through-transfer functions; validity conditions; w-element SPICE simulation; Computational modeling; Integrated circuit interconnections; Integrated circuit modeling; Receivers; Transfer functions; Transmitters; Wires; Crosstalk; differential transmission line; interconnect model; on-chip wire; printed circuit board; signal integrity;
Journal_Title :
Circuits and Systems I: Regular Papers, IEEE Transactions on
DOI :
10.1109/TCSI.2015.2407435