• DocumentCode
    479719
  • Title

    Analysis on the airport terminal bonded logistic park planning and industry economic effect

  • Author

    Li, Xiaoyu

  • Author_Institution
    Bus. Adm. Sch., North China Electr. Power Univ., Beijing
  • Volume
    1
  • fYear
    2008
  • fDate
    12-15 Oct. 2008
  • Firstpage
    1385
  • Lastpage
    1389
  • Abstract
    With the enhancing of Chinese economics, the business between cities, regions and countries expends rapidly. It causes that logistic flux is increasing, and many cities regard the establishment of logistic park as the important part of the developing stratagem of modern logistic industry. The airport terminal bonded logistic park is the typical zone for promoting international port industry and modern logistic industry which enjoys the special policy of bonded zone and adopts particular scrutiny and management mode. This paper analyzes the integrated relationship between the airport terminal bonded logistic park and the hub airport. And points out the airport terminal bonded logistic park´s basic structure and main function platform, according to the airport terminal bonded logistic park´s formation mechanisms and operating mode. Besides, as one of the focus point, this paper analyzes the airport terminal bonded logistic park´s industrial economic influence on capital economic effect, industrial-driving, industrial structure´s optimized effect, regional benefits, income effect and aggregation effect.
  • Keywords
    airports; industrial economics; logistics; planning; service industries; airport terminal bonded logistic park planning; industrial economics; international hub airport; international port industry; logistic industry; Air transportation; Airports; Bonding; Cities and towns; Industrial economics; Industrial relations; Logistics; Modems; Power generation economics; Supply chains; Airport Terminal; Bonded; Economic Effect; Logistic Park;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Service Operations and Logistics, and Informatics, 2008. IEEE/SOLI 2008. IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2012-4
  • Electronic_ISBN
    978-1-4244-2013-1
  • Type

    conf

  • DOI
    10.1109/SOLI.2008.4686617
  • Filename
    4686617