DocumentCode :
479884
Title :
Platform Maintenance Process for Software Quality Assurance in Product Line
Author :
Dong, Jong Sung ; Lee, Keun ; Kim, Kyong Hwan ; Kim, Sang Tae ; Cho, Ji Man ; Kim, Te Hi
Volume :
2
fYear :
2008
fDate :
12-14 Dec. 2008
Firstpage :
325
Lastpage :
331
Abstract :
As software products increase and continuously evolve, the improvement of software quality and increase of productivity are becoming crucial in consumer electronics. The software product line method, which develops software products by reusing software architecture and source code of product families rather than making separate software products, is gaining importance to achieve rapid responsiveness to market demand. As the software product line method becomes a core technology in consumer electronics, an issue that inevitably arises due to the reuse of software architecture is the management of platform quality through defect removal and continuous maintenance. This paper presents the details of the Platform Maintenance Process established to achieve such purpose, and validates the process through application in a business division which resulted in an approximate of 30% reduction in average defect fix time.
Keywords :
software architecture; software maintenance; software process improvement; software quality; software reusability; average defect fix time; consumer electronics; continuous maintenance; defect removal; platform maintenance process; platform quality; product families; product line; software architecture reuse; software products; software quality assurance; software quality improvement; source code; Application software; Business; Computer architecture; Consumer electronics; Productivity; Programming; Quality management; Software architecture; Software maintenance; Software quality; platform maintenace; product line; quality; software architecture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Science and Software Engineering, 2008 International Conference on
Conference_Location :
Wuhan, Hubei
Print_ISBN :
978-0-7695-3336-0
Type :
conf
DOI :
10.1109/CSSE.2008.1520
Filename :
4722063
Link To Document :
بازگشت