Research on the ultraviolet-curing resin wire saw

At present, wire saws are widely used for the hard brittle material in semiconductor and photovoltaic industry. Though many developments have been made using new types of abrasive grain and bond developments to increase the performance, there still are disadvantages in the existing wire saws. Therefore, this paper presents a new method using ultraviolet-curing resin as a bonding agent to develop a new fixed-abrasive wire saw. It makes that the manufacture of wire saw are low cost, high efficiency and environment friendly. In addition, this paper discusses some pretreatment measures in the manufacturing process. The experimental results proved that the surface pretreatment plays an important role in improving the adhesion between resin layer and piano wire.