Title : 
Sensing Power MOSFET Junction Temperature Using Circuit Output Current Ringing Decay
         
        
            Author : 
He Niu ; Lorenz, Robert D.
         
        
            Author_Institution : 
Wisconsin Electr. Machines & Power Electron. Consortium, Univ. of Wisconsin-Madison, Madison, WI, USA
         
        
        
        
        
        
        
        
            Abstract : 
Junction temperature (Tj) sensing requirements for fast MOSFET junction temperature control and high-power fast switching power converter protection are not easily met with nonintrusive techniques. This paper presents a noninvasive circuit-model-based sensing method suitable for a high-bandwidth hard-switching converter power MOSFET junction temperature estimation without any additional temperature detector. For the purpose of demonstrating MOSFET junction temperature sensing, a chopper circuit is used. The ringing superimposed with a circuit load current is used for MOSFET junction temperature estimation. A “gate drive-RDS-on-L-C” resonant model is implemented, indicating the mechanism of power MOSFET turn-on dynamics. Modeling includes the gate-drive output parasitics, power MOSFET intrinsic parameters, PCB parasitics, and load parasitics. To evaluate the methodology, LTspice simulation and experimental results are studied.
         
        
            Keywords : 
choppers (circuits); power MOSFET; power convertors; LTspice simulation; PCB parasitics; chopper circuit; circuit load current; circuit output current ringing decay; fast junction temperature control; gate-drive output parasitics; high-bandwidth hard-switching converter; high-power fast switching power converter protection; load parasitics; nonintrusive techniques; noninvasive circuit-model-based sensing method; power MOSFET junction temperature sensing; power intrinsic parameters; turn-on dynamics; Integrated circuit modeling; Junctions; MOSFET; Semiconductor device modeling; Temperature measurement; Temperature sensors; Junction; power MOSFET; temperature measurement;
         
        
        
            Journal_Title : 
Industry Applications, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TIA.2014.2344501