• DocumentCode
    483110
  • Title

    A dynamic model of electromagnetic relay including contact bounce

  • Author

    Jun, Xiong ; Jun-jia, He ; Chun-yan, Zang

  • Author_Institution
    Coll. of Electr. & Electron. Eng., Huazhong Univ. of Sci. & Technol., Wuhan
  • fYear
    2008
  • fDate
    17-20 Oct. 2008
  • Firstpage
    4144
  • Lastpage
    4149
  • Abstract
    Contact bounce of relays, which is the main cause of electric abrasion and material erosion, is inevitable. Using the mode expansion formalism, this paper presents an analytical investigation of the dynamic behavior of two different reed systems configurations. The model uses dynamic Euler-Bernoulli beam theory for cantilevered beams, includes the driving force from the electromagnetic systems, and takes into account the contact force between moving contact and stationary contact using the Kelvin-Voigt viscoelastic contact model. Analytical results have been complemented by the finite differences simulation of the beam nonlinear partial differential equations and the use of the Runge-Kutta algorithm for the modal equations. The model and simulation can be used as design tools to improve relay performance and reduce contact bounce in future designs.
  • Keywords
    Runge-Kutta methods; cantilevers; electromagnetic devices; nonlinear equations; partial differential equations; relays; Euler-Bernoulli beam theory; Kelvin-Voigt viscoelastic contact model; Runge-Kutta algorithm; beam nonlinear partial differential equations; cantilevered beams; contact bounce; contact force; electric abrasion; electromagnetic relay; finite differences simulation; material erosion; modal equations; mode expansion formalism; Algorithm design and analysis; Analytical models; Elasticity; Electromagnetic forces; Electromagnetic modeling; Finite difference methods; Partial differential equations; Relays; Structural beams; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Machines and Systems, 2008. ICEMS 2008. International Conference on
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-1-4244-3826-6
  • Electronic_ISBN
    978-7-5062-9221-4
  • Type

    conf

  • Filename
    4771514