DocumentCode :
483343
Title :
On the relevance of IC ESD performance to product quality
Author :
Smedes, T. ; Christoforou, Y.
Author_Institution :
NXP Semicond., Nijmegen, Netherlands
fYear :
2008
fDate :
7-11 Sept. 2008
Firstpage :
14
Lastpage :
20
Abstract :
Correlations between ESD stress results and return rates are investigated for various product types. It appears that CDM data relates better to product quality than HBM and/or MM data. The paper clearly demonstrates the need for application specific stress standards to cover threats coming from external connections.
Keywords :
electrostatic discharge; integrated circuit testing; ESD stress; HBM; IC ESD performance; product quality; Automotive engineering; CMOS process; CMOS technology; Earth Observing System; Electrostatic discharge; Industrial relations; Pins; Pulp and paper industry; Qualifications; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2008. EOS/ESD 2008. 30th
Conference_Location :
Tucson, AZ
Print_ISBN :
978-1-58537-146-4
Electronic_ISBN :
978-1-58537-147-1
Type :
conf
Filename :
4772110
Link To Document :
بازگشت