• DocumentCode
    483355
  • Title

    Statistical pin pair combinations — a new proposal for device level HBM tests

  • Author

    Brodbeck, Tilo ; Gaertner, Reinhold ; Stadler, Wolfgang ; Duvvury, Charvaka

  • Author_Institution
    Infineon Technol., Munich, Germany
  • fYear
    2008
  • fDate
    7-11 Sept. 2008
  • Firstpage
    106
  • Lastpage
    114
  • Abstract
    This paper proposes an alternate HBM test strategy to reflect today¿s IC designs and package. The detailed proposal outlines a new procedure where all IC pins are treated equally, and the pin pair combinations are selected statistically. Some initial experimental data is presented to illustrate the validity and advantages of this procedure.
  • Keywords
    integrated circuit design; integrated circuit packaging; integrated circuit testing; HBM test strategy; IC designs; IC package; pin pair combinations; Assembly; Electrostatic discharge; Failure analysis; Instruments; Integrated circuit packaging; Integrated circuit testing; Pins; Proposals; Stress; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2008. EOS/ESD 2008. 30th
  • Conference_Location
    Tucson, AZ
  • Print_ISBN
    978-1-58537-146-4
  • Electronic_ISBN
    978-1-58537-147-1
  • Type

    conf

  • Filename
    4772122
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=483355