DocumentCode :
48354
Title :
Frequency Trimming of Aluminum Nitride Microresonators Using Rapid Thermal Annealing
Author :
Henry, M.D. ; Nguyen, John ; Young, Travis Ryan ; Bauer, Thomas ; Olsson, Roy H.
Author_Institution :
MESA Fabrication Facility, Sandia Nat. Labs., Albuquerque, NM, USA
Volume :
23
Issue :
3
fYear :
2014
fDate :
Jun-14
Firstpage :
620
Lastpage :
627
Abstract :
To transition aluminum nitride (AlN) microresonator filters into a manufacturable technology, accurate control of the resonator frequency across a wafer is required. This paper describes a postfabrication rapid thermal anneal approach to trim resonator frequency over 27000 ppm with an accuracy of 500 ppm. Measurements made on 22.4 MHz resonators indicate that the effect of annealing on the resonators saturates in 5 min and upshift the resonator frequency super linearly with temperature. We replicate the frequency trimming effect on hermetically sealed wafer level packaged devices to reduce the across-wafer frequency distribution from 22000 to 4000 ppm. We confirm that this postannealing technique is permanent by temperature cycling the resonators from 50°C to 125°C. This technique provides a method to trim AlN microresonator frequency overcoming effects such as thin film variations, which are inherent to microsystems fabrication.
Keywords :
III-V semiconductors; aluminium compounds; hermetic seals; microcavities; micromechanical resonators; rapid thermal annealing; semiconductor thin films; wafer level packaging; AlN; across-wafer frequency distribution; aluminum nitride microresonators; frequency 22.4 MHz; frequency trimming; hermetically sealed wafer level packaged devices; manufacturable technology; microresonator filters; microsystems fabrication; rapid thermal annealing; resonator frequency; temperature cycling; thin film variations; time 5 min; transition aluminum nitride; Annealing; Fabrication; Frequency measurement; III-V semiconductor materials; Metals; Resonant frequency; Temperature measurement; Microresonators; acoustic resonators; microelectromechanical devices; rapid thermal annealing; wafer scale integration; wafer scale integration.;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2013.2283801
Filename :
6630061
Link To Document :
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