Practical Thermal Design Considerations for IPEM-based Converter

Author

Chen, Qiaoliang ; Yang, Xu ; Wang, Zhao-an

Author_Institution

Sch. of Electr. Eng., Xi´´an Jiaotong Univ.

Volume

1

fYear

2006

fDate

14-16 Aug. 2006

Firstpage

1

Lastpage

5

Abstract

In this paper, a 2 kW PFC active IPEM (integrated power electronics modules) employing CoolMOS and SiC diode is developed. The thermal model of IPEM is developed and the power dissipation of every power devices in the active IPEM is calculated through the measurement-based power loss graph in datasheet. With the requirements of uniform temperature distribution and slight thermal interaction between power dice, the variation of temperature gradient distribution with the heat transfer coefficient of heatsink and die position is analyzed. The thermal interaction distance of power die is investigated and the tradeoff between thermal and electrical design is considered. The analysis is verified by the simulation results

Keywords

heat transfer; power integrated circuits; temperature distribution; thermal management (packaging); 2 kW; CoolMOS; PFC active IPEM-converter; SiC diode; die position analysis; heat transfer coefficient; heatsink; temperature gradient distribution; Electronic packaging thermal management; Heat sinks; Heat transfer; Power dissipation; Power electronics; Schottky diodes; Semiconductor diodes; Silicon carbide; Temperature distribution; Thermal conductivity; integrated power electronics modules; thermal;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics and Motion Control Conference, 2006. IPEMC 2006. CES/IEEE 5th International

Conference_Location

Shanghai

Print_ISBN

1-4244-0448-7

Type

conf

DOI

10.1109/IPEMC.2006.4778062

Filename

4778062