Title :
Accurate Simulation of Transistor-Level Variability for the Purposes of TCAD-Based Device-Technology Cooptimization
Author :
Gerrer, Louis ; Brown, Andrew R. ; Millar, Campbell ; Hussin, Razaidi ; Amoroso, Salvatore Maria ; Binjie Cheng ; Reid, Dave ; Alexander, Craig ; Fried, David ; Hargrove, Michael ; Greiner, Ken ; Asenov, Asen
Author_Institution :
Device Modelling Group Sch. of Eng., Univ. of Glasgow, Glasgow, UK
Abstract :
In this paper we illustrate how the predictive Technology Computer Aided Design (TCAD) process device simulation can be used to evaluate process, statistical, and time-dependent variability at the early stage of the development of new technology. This is critically important for the delivery of accurate early Process Design Kits, including process variability, statistical variability, time-dependent variability (degradation) and their interactions and correlations. This is also critical to the TCAD-based Design-Technology Co-Optimisation (DTCO). To accomplish this task, the fast, large area Coventor virtual fabrication platform SEMulator3D was integrated in the GoldStandradSimulations TCAD-based DTCO tool chain. Published data for Intel 22-nm FinFET technology are used to illustrate and validate the results of the TCAD process and device simulation, the compact model extraction, and the statistical circuit simulation.
Keywords :
MOSFET; semiconductor device models; statistical analysis; technology CAD (electronics); Coventor virtual fabrication platform; DTCO; Gold-StandradSimulations; Intel FinFET technology; SEMulator3D; TCAD-based device technology cooptimization; process design kit; process variability; size 22 nm; statistical circuit simulation; statistical variability; technology computer aided design; time-dependent variability; transistor-level variability simulation accuracy; Doping; FinFETs; Integrated circuit modeling; Logic gates; Semiconductor device modeling; Semiconductor process modeling; Compact model; Design-Technology Co-Optimisation (DTCO); Technology Computer Aided Design (TCAD); device; simulation; variation; virtual fabrication; virtual fabrication.;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2015.2402440