Automated Control of Electroplating Chemical Process in Printed Wiring Boards-State of the Art

CARLTECH ASSOCIATES reviewed the state of the art of automatic control in printed wiring board (PWB) electroplating processes. We surveyed the literature and individuals, investigated allied industries, and screened nearly 300 vendors. The most advanced controllers are proprietary using polarographic, spectrophotometric,or titrimetric monitoring and microprocessor control. Electroless, copper controllers are connercially available using a combination of spectroscopic, specification and autotitration monitoring with analog control. Monitoring and control of brighteners is feasible using polarographic or cyclic voltametric stripping technology. On-line controllers can be developed with present technology for copper cyanide, acid copper, and tin/lead plating processes.