DocumentCode :
49013
Title :
Observation and Elimination of Recoil Particles From Turbo Molecular Pumps
Author :
Moriya, Tsuyoshi ; Sugawara, Eiichi ; Matsui, Hidefumi
Author_Institution :
Technol. Dev. Center, Tokyo Electron Ltd., Tokyo, Japan
Volume :
28
Issue :
3
fYear :
2015
fDate :
Aug. 2015
Firstpage :
253
Lastpage :
259
Abstract :
The existence of recoil particles from the turbo molecular pump has been verified. The recoil particles may be the root cause of yield degradation for the vacuum processes such as the plasma etching processes. To eliminate the recoil particles, they must be trapped inside the turbo molecular pump or inside the manifold chamber. After experimenting with various materials and designs, we have built a novel recoil particle trap and verified its effectiveness in a semiconductor production line.
Keywords :
particle traps; pumps; semiconductor device manufacture; sputter etching; manifold chamber; plasma etching process; recoil particle trap; semiconductor production line; turbo molecular pump; vacuum process; yield degradation; Blades; Cotton; Etching; Manifolds; Plasmas; Valves; Plasma applications; Semiconductor device manufacture; Semiconductor device manufacturer; Vacuum technology; particle measurements; plasma applications; vacuum technology;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2015.2427912
Filename :
7097729
Link To Document :
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