• DocumentCode
    493278
  • Title

    Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method

  • Author

    Lin, Ming-Tzer ; Chi-Jia Tong ; Cheng, Ya-Chi ; Chung, Kuan-Jung ; Hsu, Jiong-Shiun

  • Author_Institution
    Inst. of Precision Eng., Nat. Chung Hsing Univ., Taichung
  • fYear
    2009
  • fDate
    1-3 April 2009
  • Firstpage
    140
  • Lastpage
    144
  • Abstract
    A paddle-like cantilever beam was designed and developed as a specimen to measure the mechanical behavior of thin films. This beam is in triangle shape in order to provide uniform plane strain distribution and standard clean room processing was used to prepare the sample. The residual stress measurement of thin films application for MEMS were studied with the deflections of silver, gold, and copper films (50-250 nm) driven by the electrostatic force and measured using four step phase-shifting method. The results present that the test structure and the optical (FSPS) method work excellently. Furthermore, silver presents that the deflection decreases after deposition to demonstrate that the tensile residual stress in the film. Oppositely, gold and copper films show compressive residual stress in them.
  • Keywords
    beams (structures); cantilevers; copper; gold; internal stresses; metallic thin films; micromechanical devices; nanostructured materials; phase shifting interferometry; silver; Ag; Au; Cu; MEMS; compressive residual stress; copper films; four step phase-shifting method; gold films; mechanical properties; nanoscale thin films; paddle-like cantilever beam; silver films; size 50 nm to 250 nm; tensile residual stress; uniform plane strain distribution; Electrostatic measurements; Force measurement; Mechanical factors; Optical films; Optical interferometry; Phase measurement; Phase shifting interferometry; Residual stresses; Stress measurement; Transistors; damping behavior of thin films for MEMS; mechanical behavior of thin films; test structure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-3874-7
  • Type

    conf

  • Filename
    4919482