DocumentCode
493278
Title
Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method
Author
Lin, Ming-Tzer ; Chi-Jia Tong ; Cheng, Ya-Chi ; Chung, Kuan-Jung ; Hsu, Jiong-Shiun
Author_Institution
Inst. of Precision Eng., Nat. Chung Hsing Univ., Taichung
fYear
2009
fDate
1-3 April 2009
Firstpage
140
Lastpage
144
Abstract
A paddle-like cantilever beam was designed and developed as a specimen to measure the mechanical behavior of thin films. This beam is in triangle shape in order to provide uniform plane strain distribution and standard clean room processing was used to prepare the sample. The residual stress measurement of thin films application for MEMS were studied with the deflections of silver, gold, and copper films (50-250 nm) driven by the electrostatic force and measured using four step phase-shifting method. The results present that the test structure and the optical (FSPS) method work excellently. Furthermore, silver presents that the deflection decreases after deposition to demonstrate that the tensile residual stress in the film. Oppositely, gold and copper films show compressive residual stress in them.
Keywords
beams (structures); cantilevers; copper; gold; internal stresses; metallic thin films; micromechanical devices; nanostructured materials; phase shifting interferometry; silver; Ag; Au; Cu; MEMS; compressive residual stress; copper films; four step phase-shifting method; gold films; mechanical properties; nanoscale thin films; paddle-like cantilever beam; silver films; size 50 nm to 250 nm; tensile residual stress; uniform plane strain distribution; Electrostatic measurements; Force measurement; Mechanical factors; Optical films; Optical interferometry; Phase measurement; Phase shifting interferometry; Residual stresses; Stress measurement; Transistors; damping behavior of thin films for MEMS; mechanical behavior of thin films; test structure;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
Conference_Location
Rome
Print_ISBN
978-1-4244-3874-7
Type
conf
Filename
4919482
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