Title :
Thermal management integration for microfluidics applications
Author :
Camps, T. ; Marty, B. ; Tasselli, J. ; Marty, A. ; Lagrange, D.
Author_Institution :
LAAS, CNRS, Toulouse
Abstract :
This paper reports on the design and fabrication of integrated thermal sensors or thermal sources for various MEMS applications and particularly microfluidics applications. The capabilities of polysilicon diodes as thermal sensors are demonstrated with good thermal sensitivities (55 mV/degC). An instrumentation platform has also been developed to measure the temperature variations through microchannels.
Keywords :
microfluidics; semiconductor diodes; temperature measurement; temperature sensors; thermal management (packaging); MEMS applications; integrated thermal sensors; microchannels; microfluidics; polysilicon diodes; temperature variation measurement; thermal management integration; thermal sensitivities; thermal sources; Diodes; Fabrication; Instruments; Microchannel; Microfluidics; Micromechanical devices; Temperature measurement; Temperature sensors; Thermal management; Thermal sensors;
Conference_Titel :
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3874-7
