Title :
Design aspects of 3D integration of MEMS-based systems
Author :
Schneider, Peter ; Reitz, Sven ; Stolle, Jörn ; Martin, Roland
Author_Institution :
Div. Design Autom., Fraunhofer Inst. for Integrated Circuits, Dresden
Abstract :
Due to high integration density the influence of manufacturing technologies on the system behavior has to be considered in the design process of 3D systems. Therefore, information from different physical domains has to be provided to designers. The variety of structures and physical effects requires efficient modeling approaches and simulation algorithms. In the following a modular approach which covers detailed analysis with PDE solvers and more abstract behavioral modeling is described.
Keywords :
finite element analysis; micromechanical devices; thermal management (packaging); 3D integration system design; FEM model; MEMS-based system; PDE solvers; abstract behavioral modeling; thermal management; Acoustic sensors; Mechanical sensors; Packaging; Power system interconnection; Power system modeling; Process design; Radio frequency; Sensor arrays; Sensor systems; Thermal management;
Conference_Titel :
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3874-7
