• DocumentCode
    493353
  • Title

    A bidirectional vibration powered electric energy generator based on electrostatic transduction using In-Plane Overlap Plate (IPOP) mechanism

  • Author

    Paracha, Ayyaz Mahmood ; Basset, Philippe ; Galayko, Dimitri ; Marty, Frédéric ; Bourouina, Tarik

  • Author_Institution
    ESIEE-ESYCOM, Noisy-le-Grand
  • fYear
    2009
  • fDate
    1-3 April 2009
  • Firstpage
    300
  • Lastpage
    303
  • Abstract
    In this paper, the design, fabrication and initial characterization results of a bidirectional, vibration powered, bulk silicon-based electric energy generator are addressed. The converter is based on an In-Plane Overlap Plate (IPOP) configuration. Its mechanical design is inspired from 2D gyroscope. In most of real systems, the axis of the external vibrations is not known and if we assume that the available energy is equally distributed over the three degrees of freedom, the ldquo2Drdquo-transducer is potentially twice more efficient than its one-degree of freedom counterparts. The maximum theoretical power convertible from the mechanical to electrical domain is predicted using the mechanical resonance frequency characterization along with FEM simulations based capacitance variation. With 6 V pre-charge voltage the maximum theoretical power converted is 2.6 muW at a 246 Hz vibration frequency from a 10 times 10 times 0.9 mm3 transducer.
  • Keywords
    capacitors; convertors; electric generators; finite element analysis; gyroscopes; silicon; transducers; 2D gyroscope; 2D transducers; FEM simulations; Si; bidirectional vibration powered electric energy generator; bulk silicon-based electric energy generator; capacitance variation; converter; electrostatic transduction; frequency 246 Hz; in-plane overlap plate mechanism; mechanical resonance frequency; power 2.6 muW; voltage 6 V; Character generation; Electrostatics; Fabrication; Frequency conversion; Gyroscopes; Power generation; Predictive models; Resonance; Resonant frequency; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-3874-7
  • Type

    conf

  • Filename
    4919558