Title :
Superconducting 4–8-GHz Hybrid Assembly for 2SB Cryogenic THz Receivers
Author :
Rashid, H. ; Meledin, Denis ; Desmaris, V. ; Pavolotsky, A. ; Belitsky, V.
Author_Institution :
Group of Adv. Receiver Dev. (GARD), Chalmers Univ. of Technol., Gothenburg, Sweden
Abstract :
We present here the design and characterization of an intermediate frequency (IF) assembly comprising a compact 90° hybrid chip (coupled line coupler - Lange coupler- coupled line coupler), two bias-T circuits for biasing the superconductor-insulator-superconductor (SIS) mixers, and two transmission-line circuits. Specifically, the miniaturized three-section hybrid chip fabricated using thin-film technology utilizes superconducting Niobium (Nb) transmission lines, air bridges to connect the fingers of the Lange coupler (middle section), and is complemented with two bias-T circuits with integrated MIM capacitors. The assembly was designed to ensure amplitude and phase imbalances better than 0.6 dB and ±2°, respectively. Experimental verification of the assembly at 4 K shows good agreement between the measurements and simulations with amplitude imbalance of 0.5 dB and maximum phase imbalance of ±2°. The ALMA band-5 (163-211 GHz) receiver will include such assembly. The receiver tests shows sideband rejection ratio better than 15 dB over the entire RF band, i.e., a systematic improvement of 3-9 dB as compared with the previously reported results.
Keywords :
MIM devices; cryogenic electronics; niobium; submillimetre wave receivers; superconducting transmission lines; superconductor-insulator-superconductor mixers; thin film devices; waveguide couplers; ALMA band-5 receiver; IF assembly; Lange coupler; SIS mixers; air bridges; amplitude imbalance; bias-T circuits; compact hybrid chip; coupled line coupler; cryogenic THz receivers; frequency 163 GHz to 211 GHz; frequency 4 GHz to 8 GHz; integrated MIM capacitors; intermediate frequency assembly; phase imbalance; receiver tests; sideband rejection ratio; superconducting Niobium transmission lines; superconducting hybrid assembly; superconductor-insulator-superconductor mixers; temperature 4 K; thin-film technology; three-section hybrid chip; transmission-line circuits; Amplitude modulation; Assembly; Calibration; Couplers; Couplings; Receivers; Superconducting microwave devices; 2SB receiver; Directional coupler; microwave components; super conducting devices; thin-film circuits;
Journal_Title :
Terahertz Science and Technology, IEEE Transactions on
DOI :
10.1109/TTHZ.2013.2294761