Title :
High-gain on-chip antennas for LSI intra-/inter-chip wireless interconnection
Author :
Kimoto, K. ; Sasaki, N. ; Kubota, S. ; Moriyama, W. ; Kikkawa, T.
Author_Institution :
Res. Inst. for Nanodevice & Bio Syst., Hiroshima Univ., Higashi
Abstract :
A wireless interconnection technology using on-chip antennas has been proposed for three dimensional packaging of LSI chips. The issues of on-chip antennas are extremely low gain due to lossy Si substrates. In this study, we developed a high gain on-chip antenna structure by thinning the Si substrate thickness and optimizing interposer thickness underlying the Si substrate. The transmission coefficient increased from -93 dB to -31 dB at the distance of 20 mm for inter-chip communication between 180 nm CMOS chips.
Keywords :
CMOS integrated circuits; antennas; integrated circuit interconnections; large scale integration; silicon; CMOS chips; LSI intrainterchip wireless interconnection; high-gain onchip antennas; size 20 nm; three dimensional packaging; transmission coefficient; Conductivity; Couplings; Dielectric substrates; Inductors; Integrated circuit interconnections; Large scale integration; Packaging; Spirals; System-on-a-chip; Transmitting antennas;
Conference_Titel :
Antennas and Propagation, 2009. EuCAP 2009. 3rd European Conference on
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-4753-4
Electronic_ISBN :
978-3-00-024573-2