DocumentCode :
494843
Title :
Sandwich composite approach for EMI shielding structures
Author :
Dasgupta, Samudra ; Sekhar, K. Ravi ; Ravishankar, B.N. ; Kumar, M. N Jagdish ; Sankaran, S.
Author_Institution :
Aeronaut. Dev. Establ., DRDO, Bangalore, India
fYear :
2008
fDate :
26-27 Nov. 2008
Firstpage :
451
Lastpage :
456
Abstract :
A sandwich composite approach has been employed to develop epoxy based polymer matrix composite materials to realize a class of lightweight structures capable of shielding electromagnetic interference (EMI). Hollow glass microspheres embedded syntactic foams (thickness ap 2 mm; density ap 0.6 g/cc) of two different varieties have been used as core materials in these sandwich constructions (total thickness ap 2.6 mm; effective density ap 0.75 g/cc). The choice of the exact polymer system was guided by the desired temperature withstandability, whereas the choice of the reinforcements was a function of the EMI shielding, structural and other requirements. These sandwich composites were characterized for their shielding effectiveness (SE) in the frequency band of 1 MHz to 100 MHz by coaxial jig method. The materials were also evaluated for their structural capabilities by 3 point bend flexural testing whereas the viscoelastic properties and glass transition temperature (Tg) were measured by dynamic mechanical analysis (DMA). The results amply demonstrated the scope of tailoring such lightweight materials for specific end-use requirements by suitable selection of matrix - core material - skin combinations. Some specific application sectors considered in the present paper include (i) high strength (>250 MPa) /modulus (>15 GPa) - moderate SE (>35 dB) - room temperature applications; (ii) low strength (ap100 MPa) / modulus (ap5 GPa) - high SE (>70 dB) - room temperature applications; (iii) optimized strength (>140 MPa) / modulus (>10 GPa), SE (>65 dB) - elevated temperature applications (les150degC) etc.
Keywords :
bending strength; composite materials; electromagnetic interference; electromagnetic shielding; electronics packaging; materials testing; polymers; sandwich structures; viscoelasticity; 3 point bend flexural testing; EMI shielding; coaxial jig method; dynamic mechanical analysis; electromagnetic interference; glass transition temperature; hollow glass microspheres; polymer matrix composite materials; sandwich composite approach; shielding effectiveness; viscoelasticity; Building materials; Coaxial components; Composite materials; Electromagnetic interference; Frequency; Glass; Lightweight structures; Polymers; Temperature; Transmission line matrix methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Interference & Compatibility, 2008. INCEMIC 2008. 10th International Conference on
Conference_Location :
Bangalore
Print_ISBN :
978-81-903575-1-7
Type :
conf
Filename :
5154328
Link To Document :
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