• DocumentCode
    494862
  • Title

    Modeling and analysis of coupling in gapped ground plane

  • Author

    Leena, G. ; Mariappan, Rajeswari ; Salil, P. ; Subbarao, B.

  • Author_Institution
    ECE Dept., Kumaraguru Coll. of Technol., Coimbatore, India
  • fYear
    2008
  • fDate
    26-27 Nov. 2008
  • Firstpage
    579
  • Lastpage
    584
  • Abstract
    This paper describes the mathematical modeling of the gapped ground plane structure used for suppressing the simultaneous switching noise (SSN) or ground bounce noise (GBN) in high speed printed circuit boards. The coupling coefficient for the gapped ground plane with a slot or split with feed line was analyzed using Ansoft HFSS (high frequency structure simulator) package and it was verified by measurement. Mathematically the power plane with slot or split was modeled and the coupling coefficient (S12) at the gapped ground plane was analyzed using a fast algorithm based on a full cavity-mode resonator model and the segmentation method. Inductance and capacitance model was used to account for the field coupling along the slot and the split, respectively. The effectiveness of the segmentation method and the inductance-capacitance model for the gapped structure has been demonstrated by good agreement between the simulated, measured and calculated results.
  • Keywords
    circuit analysis computing; coupled circuits; printed circuits; Ansoft; coupling; gapped ground plane structure; ground bounce noise; high frequency structure simulator; high speed printed circuit boards; mathematical modeling; simultaneous switching noise; Analytical models; Circuit noise; Circuit simulation; Coupling circuits; Feeds; Frequency; Mathematical model; Packaging; Printed circuits; Switching circuits; Coupling Coefficient; Fast Algorithm; GBN; Gapped ground plane structure; High Speed Printed Circuit Boards; Inductance-Capacitance model; Isolation; SSN; full cavity-mode resonator model; segmentation method;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Interference & Compatibility, 2008. INCEMIC 2008. 10th International Conference on
  • Conference_Location
    Bangalore
  • Print_ISBN
    978-81-903575-1-7
  • Type

    conf

  • Filename
    5154362