DocumentCode :
494862
Title :
Modeling and analysis of coupling in gapped ground plane
Author :
Leena, G. ; Mariappan, Rajeswari ; Salil, P. ; Subbarao, B.
Author_Institution :
ECE Dept., Kumaraguru Coll. of Technol., Coimbatore, India
fYear :
2008
fDate :
26-27 Nov. 2008
Firstpage :
579
Lastpage :
584
Abstract :
This paper describes the mathematical modeling of the gapped ground plane structure used for suppressing the simultaneous switching noise (SSN) or ground bounce noise (GBN) in high speed printed circuit boards. The coupling coefficient for the gapped ground plane with a slot or split with feed line was analyzed using Ansoft HFSS (high frequency structure simulator) package and it was verified by measurement. Mathematically the power plane with slot or split was modeled and the coupling coefficient (S12) at the gapped ground plane was analyzed using a fast algorithm based on a full cavity-mode resonator model and the segmentation method. Inductance and capacitance model was used to account for the field coupling along the slot and the split, respectively. The effectiveness of the segmentation method and the inductance-capacitance model for the gapped structure has been demonstrated by good agreement between the simulated, measured and calculated results.
Keywords :
circuit analysis computing; coupled circuits; printed circuits; Ansoft; coupling; gapped ground plane structure; ground bounce noise; high frequency structure simulator; high speed printed circuit boards; mathematical modeling; simultaneous switching noise; Analytical models; Circuit noise; Circuit simulation; Coupling circuits; Feeds; Frequency; Mathematical model; Packaging; Printed circuits; Switching circuits; Coupling Coefficient; Fast Algorithm; GBN; Gapped ground plane structure; High Speed Printed Circuit Boards; Inductance-Capacitance model; Isolation; SSN; full cavity-mode resonator model; segmentation method;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Interference & Compatibility, 2008. INCEMIC 2008. 10th International Conference on
Conference_Location :
Bangalore
Print_ISBN :
978-81-903575-1-7
Type :
conf
Filename :
5154362
Link To Document :
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