Investigation of the MeshFree RPIM Solution for a Haptic Sensing Approach to MEMS Design

Author

Munier, Jean-Baptiste ; Laghrouche, Omar ; Desmulliez, Marc P Y

Author_Institution

Microsyst. Eng. Centre, Heriot-Watt Univ., Edinburgh, UK

Volume

2

fYear

2009

fDate

March 31 2009-April 2 2009

Firstpage

97

Lastpage

101

Abstract

The specifications required at the design stage for the thermal management of MEMS based on haptic sensing are studied. The use of a meshfree method is proposed for the computation in real time of the temperature distribution within the system. We describe the problematic of a haptic environment and the critical issues associated with the process of merging design and simulation.

Keywords

CAD; electronic design automation; haptic interfaces; interpolation; micromechanical devices; thermal management (packaging); CAD tool; MEMS design; haptic sensing approach; meshfree RPIM solution; radial point interpolation method; real time computation; temperature distribution; thermal management; Computational efficiency; Computational modeling; Computer science; Design engineering; Force feedback; Haptic interfaces; Mesh generation; Micromechanical devices; Prototypes; Thermal management; Design; Haptic; MEMS; Meshfree; RPIM;

fLanguage

English

Publisher

ieee

Conference_Titel

Computer Science and Information Engineering, 2009 WRI World Congress on

Conference_Location

Los Angeles, CA

Print_ISBN

978-0-7695-3507-4

Type

conf

DOI

10.1109/CSIE.2009.853

Filename

5171308