Title :
Acoustic Tomography for Detecting a Hot Spot in Grain Bulk
Author :
Yan, Hua ; Cui, Ke Xin ; Liu, Li Jun ; Qi, Yue
Author_Institution :
Sch. of Inf. Sci. & Eng., Shenyang Univ. of Technol., Shenyang, China
Abstract :
A hot spot is a localized high temperature zone in a grain bulk and normally spoilage begins in this location. Acoustic temperature tomography for detecting a hot spot in grain bulk is investigated. The region monitored is assumed to be square and divided into 400 pixels. 16 sound sources/receivers are set on its periphery. An acoustic temperature field reconstruction algorithm based on inverse multiquadrics approximation and truncated singular value decomposition is proposed. Using this algorithm, 400 temperature field models with a hot spot positioned at the midpoint of each pixel in turn have been reconstructed from exact or perturbed time-of-flight data. Reconstruction results indicate that the algorithm proposed is good at reconstructing hot spot temperature, especially at reconstructing hot spot position. Thus it is expected to be used in detecting hot spots in grain bulk.
Keywords :
acoustic signal processing; acoustic tomography; agricultural products; approximation theory; signal reconstruction; singular value decomposition; acoustic temperature field reconstruction algorithm; acoustic temperature tomography; grain bulk; hot spot detection; hot spot position reconstruction; inverse multiquadrics approximation; localized high temperature zone; spoilage; time-of-flight data; truncated singular value decomposition; Acoustic measurements; Acoustic signal detection; Acoustic waves; Monitoring; Reconstruction algorithms; Singular value decomposition; Temperature distribution; Temperature measurement; Temperature sensors; Tomography; acoustic tomography; hot spot detection; reconstruction algorithm; stored grain; temperature measurement;
Conference_Titel :
Measuring Technology and Mechatronics Automation, 2009. ICMTMA '09. International Conference on
Conference_Location :
Zhangjiajie, Hunan
Print_ISBN :
978-0-7695-3583-8
DOI :
10.1109/ICMTMA.2009.411