Title :
A CMOS accelerometer using bondwire inertial sensing
Author :
Liao, Y.-T. ; Biederman, W. ; Otis, B.
Author_Institution :
Department of Electrical Engineering, University of Washington, Seattle, 98195, USA
Abstract :
This paper presents an accelerometer that utilizes standard IC bondwires as an inertial sensor, requiring no external components or MEMS processing. The readout circuitry is implemented in a standard 0.13 µm CMOS process and detects the change in mutual inductance caused by the relative deflection of adjacent bondwires. The accelerometer has a measured sensitivity of 10 kHz/g with a bandwidth of 700 Hz, a bias stability of 35 mg and consumes 9 mA from a 1.5 V supply.
Keywords :
Acceleration; Accelerometers; Bonding; Circuits; Frequency; Gold; Inductance; Oscillators; Packaging; Phase locked loops;
Conference_Titel :
VLSI Circuits, 2009 Symposium on
Conference_Location :
Kyoto, Japan
Print_ISBN :
978-1-4244-3307-0
Electronic_ISBN :
978-4-86348-001-8
