• DocumentCode
    49835
  • Title

    Dependence of Cell Distance and Well-Contact Density on MCU Rates by Device Simulations and Neutron Experiments in a 65-nm Bulk Process

  • Author

    Kuiyuan Zhang ; Furuta, J. ; Kobayashi, Kaoru ; Onodera, Hidetoshi

  • Author_Institution
    Kyoto Inst. of Technol., Kyoto Univ., Kyoto, Japan
  • Volume
    61
  • Issue
    4
  • fYear
    2014
  • fDate
    Aug. 2014
  • Firstpage
    1583
  • Lastpage
    1589
  • Abstract
    Technology scaling increases the role of charge sharing and bipolar effect with respect to multiple cell upset. We analyze the contributions of cell distance and well-contact density to suppress MCU by device-level simulations and neutron experiments. Device simulation results reveal that the ratio of MCU to SEU exponentially decreases by increasing the distance between redundant latches. MCU is suppressed when well contacts are placed between redundant latches. Experimental results also show that the ratio of MCU to SEU exponentially decreases by increasing the distance between cells. MCU is suppressed effectively by increasing the density of well contacts.
  • Keywords
    flip-flops; neutron effects; radiation hardening (electronics); MCU; SEU; bipolar effect; cell distance; charge sharing; multiple cell upsets; neutron experiments; redundant latches; single event upset; size 65 nm; technology scaling; well-contact density; Electric potential; Integrated circuit modeling; Inverters; Latches; Layout; Neutrons; Shift registers; Device-stimulation; MCU; neutron irradiation; parasitic bipolar effect; soft error;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2014.2314292
  • Filename
    6832610