DocumentCode
49835
Title
Dependence of Cell Distance and Well-Contact Density on MCU Rates by Device Simulations and Neutron Experiments in a 65-nm Bulk Process
Author
Kuiyuan Zhang ; Furuta, J. ; Kobayashi, Kaoru ; Onodera, Hidetoshi
Author_Institution
Kyoto Inst. of Technol., Kyoto Univ., Kyoto, Japan
Volume
61
Issue
4
fYear
2014
fDate
Aug. 2014
Firstpage
1583
Lastpage
1589
Abstract
Technology scaling increases the role of charge sharing and bipolar effect with respect to multiple cell upset. We analyze the contributions of cell distance and well-contact density to suppress MCU by device-level simulations and neutron experiments. Device simulation results reveal that the ratio of MCU to SEU exponentially decreases by increasing the distance between redundant latches. MCU is suppressed when well contacts are placed between redundant latches. Experimental results also show that the ratio of MCU to SEU exponentially decreases by increasing the distance between cells. MCU is suppressed effectively by increasing the density of well contacts.
Keywords
flip-flops; neutron effects; radiation hardening (electronics); MCU; SEU; bipolar effect; cell distance; charge sharing; multiple cell upsets; neutron experiments; redundant latches; single event upset; size 65 nm; technology scaling; well-contact density; Electric potential; Integrated circuit modeling; Inverters; Latches; Layout; Neutrons; Shift registers; Device-stimulation; MCU; neutron irradiation; parasitic bipolar effect; soft error;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.2014.2314292
Filename
6832610
Link To Document