DocumentCode :
50017
Title :
High-Power High-Efficiency Class-E-Like Stacked mmWave PAs in SOI and Bulk CMOS: Theory and Implementation
Author :
Chakrabarti, Anandaroop ; Krishnaswamy, Harish
Author_Institution :
Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
Volume :
62
Issue :
8
fYear :
2014
fDate :
Aug. 2014
Firstpage :
1686
Lastpage :
1704
Abstract :
Series stacking of multiple devices is a promising technique that can help overcome some of the fundamental limitations of CMOS technology in order to improve the output power and efficiency of CMOS power amplifiers (PAs), particularly at millimeter-wave (mmWave) frequencies. This paper investigates the concept of device stacking in the context of the Class-E family of nonlinear switching PAs at mmWave frequencies. Fundamental limits on achievable performance of a stacked configuration are presented along with design guidelines for a practical implementation. In order to demonstrate the utility of stacking, three prototypes have been implemented: two fully integrated 45-GHz single-ended Class-E-like PAs with two- and four-stacked devices in IBM´s 45-nm silicon-on-insulator (SOI) CMOS technology, and a 45-GHz differential Class-E-like PA with two devices stacked in IBM´s 65-nm low-power CMOS process. Measurement results yield a peak power-added efficiency (PAE) of 34.6% for the two-stacked 45-nm SOI CMOS PA with a saturated output power of 17.6 dBm. The measurement results also indicate true Class-E-like switching PA behavior. A peak PAE of 19.4% is measured for the four-stacked PA with a saturated output power of 20.3 dBm. The two-stacked PA exhibits the highest PAE reported for CMOS mmWave PAs, and the four-stacked PA achieves the highest output power from a fully integrated CMOS mmWave PA including those that employ power combining. The 65-nm CMOS differential two-stacked PA exhibits a peak PAE of 28.3% with a saturated differential output power of 18.2 dBm, despite the poor ON-resistance of the 65-nm low-power nMOS devices. This paper also describes the modeling of active devices for mmWave CMOS PAs for good model-hardware correlation.
Keywords :
CMOS analogue integrated circuits; MIMIC; differential amplifiers; integrated circuit design; integrated circuit modelling; low-power electronics; millimetre wave power amplifiers; silicon-on-insulator; CMOS differential two-stacked PA; CMOS power amplifiers; IBM low-power CMOS process; IBM silicon-on-insulator CMOS technology; PAE; SOI CMOS technology; bulk CMOS technology; design guideline; device series stacking; differential class-E-like PA; efficiency 19.4 percent; efficiency 28.3 percent; efficiency 34.6 percent; four-stacked device; frequency 45 GHz; fully-integrated CMOS mmWave PA; fully-integrated single-ended Class-E-like PA; high-power high-efficiency class-E-like stacked mmwave PA; low-power nMOS devices; millimeter-wave frequency; model-hardware correlation; nonlinear switching PA; peak power-added efficiency; power combining; saturated differential output power; size 45 nm; size 65 nm; two-stacked SOI CMOS PA; two-stacked device; CMOS integrated circuits; CMOS technology; Design methodology; Logic gates; Power generation; Stacking; Switches; CMOS; Class-E; high efficiency; millimeter wave (mmWave); power amplifier (PA); power device modeling; power-added efficiency (PAE); stacking;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/TMTT.2014.2327919
Filename :
6832624
Link To Document :
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