• DocumentCode
    500638
  • Title

    Mechanistic studies of resonant infrared laser ablation of polystyrene

  • Author

    Johnson, S.L. ; Haglund, R.F., Jr. ; Bubb, D.M.

  • Author_Institution
    Dept. of Phys. & Astron., Vanderbilt Univ., Nashville, TN, USA
  • fYear
    2009
  • fDate
    2-4 June 2009
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We investigate the phenomenon of resonant-infrared laser ablation of polymers using polystyrene as a model material. Ablation is initiated by a picosecond free-electron laser tuned to various infrared wavelengths that are resonant with vibrational modes of a polystyrene target. Time-resolved plume imaging, coupled with etch-depth measurements and finite-element calculations of the temperature rise indicate that ablation begins after a superheated surface layer reaches a temperature of nearly 1000C and undergoes spinodal decomposition. The majority of the ablated material is then expelled by recoil-induced ejection as the pressure of the expanding vapor plume compresses the laser-melted volume.
  • Keywords
    etching; finite element analysis; laser ablation; polymers; spinodal decomposition; time resolved spectra; vibrational modes; etch-depth measurements; finite-element calculations; infrared wavelengths; laser-melted volume; picosecond free-electron laser; polymers; polystyrene; recoil-induced ejection; resonant-infrared laser ablation; spinodal decomposition; superheated surface layer; time-resolved plume imaging; vapor plume; vibrational modes; Etching; Free electron lasers; Laser ablation; Laser modes; Laser tuning; Optical imaging; Optical materials; Polymers; Resonance; Temperature; (160.0160) Materials; (160.5470) Polymers; (310.1860) Deposition and fabrication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics, 2009 and 2009 Conference on Quantum electronics and Laser Science Conference. CLEO/QELS 2009. Conference on
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    978-1-55752-869-8
  • Electronic_ISBN
    978-1-55752-869-8
  • Type

    conf

  • Filename
    5226052