Title :
Provably good and practically efficient algorithms for CMP
Author :
Chunyang Feng ; Hai Zhou ; Changhao Yan ; Jun Tao ; Xuan Zeng
Author_Institution :
Microelectron. Dept., Fudan Univ., Shanghai, China
Abstract :
To reduce chip-scale topography variation in chemical mechanical polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous researches formulated the dummy fill problem as a standard linear program (LP). However, solving the huge linear program formed by real-life designs is very expensive and has become the hurdle in deploying the technology. Even though there exist efficient heuristics, their performance cannot be guaranteed. In this paper, we develop a dummy fill algorithm that is both efficient and with provably good performance. It is based on a fully polynomial time approximation scheme [Fleischer, 2004 ] for covering LP problems. Furthermore, based on the approximation algorithm, we also propose a new greedy iterative algorithm to achieve high quality solutions more efficiently than previous Monte-Carlo based heuristic methods. Experimental results demonstrate the effectiveness and efficiency of our algorithms.
Keywords :
approximation theory; chemical mechanical polishing; chip scale packaging; computational complexity; greedy algorithms; linear programming; chemical mechanical polishing process; chip scale topography; dummy fill algorithm; greedy iterative algorithm; linear program; polynomial time approximation; Algorithm design and analysis; Approximation algorithms; Computer aided manufacturing; Filling; Iterative algorithms; Permission; Polynomials; Runtime; Surfaces; Tiles; Covering Linear Programming; Design for Manufacturability; Dummy Fill Problem;
Conference_Titel :
Design Automation Conference, 2009. DAC '09. 46th ACM/IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-6055-8497-3