Title :
A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extraction
Author :
Chai, Wenwen ; Jiao, Dan ; Koh, Cheng-Kok
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Abstract :
State-of-the-art integral-equation-based solvers rely on techniques that can perform a matrix-vector multiplication in O(N) complexity. In this work, a fast inverse of linear complexity was developed to solve a dense system of linear equations directly for the capacitance extraction of any arbitrary shaped 3D structure. The proposed direct solver has demonstrated clear advantages over state-of-the-art solvers such as FastCap and HiCap; with fast CPU time and modest memory consumption, and without sacrificing accuracy. It successfully inverts a dense matrix that involves more than one million unknowns associated with a large-scale on-chip 3D interconnect embedded in inhomogeneous materials. Moreover, we have successfully applied the proposed solver to full-wave extraction.
Keywords :
capacitance; computational complexity; electric impedance; integral equations; integrated circuit interconnections; matrix algebra; arbitrary shaped 3D structure; direct integral-equation solver; full-wave extraction; impedance extraction; large-scale 3D capacitance; large-scale on-chip 3D interconnect; linear complexity; linear equation; matrix-vector multiplication; memory consumption; Capacitance; Central Processing Unit; Costs; Electrodynamics; Fasteners; Impedance; Integral equations; Kernel; Large-scale systems; Permission; Integral-equation-based methods; capacitance extraction; direct solver; full wave;
Conference_Titel :
Design Automation Conference, 2009. DAC '09. 46th ACM/IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-6055-8497-3