Title :
Interconnection fabric design for tracing signals in post-silicon validation
Author :
Liu, Xiao ; Xu, Qiang
Author_Institution :
Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Hong Kong, China
Abstract :
Post-silicon validation has become an essential step in the design flow of today´s complex integrated circuits. One effective technique that provides real-time visibility to the circuit under debug (CUD) is to monitor and trace internal signals during its normal operation. Typically, a large number of signals are tapped and a subset of them are selected to be observed in each debug process. These trace signals need to be transferred to on-chip buffers and/or off-chip trace ports for analysis. Existing solutions use multiplexer trees or specific access networks to conduct the above duty, which, however, either provide less visibility to the CUD or result in high hardware cost. In this paper, we propose a novel trace signal interconnection fabric design to tackle the above problem. Experimental results on benchmark circuits show the efficacy of the proposed solution.
Keywords :
integrated circuit design; integrated circuit interconnections; integrated circuit testing; silicon; access networks; circuit under debug; complex integrated circuits; interconnection fabric design; multiplexer trees; off-chip trace ports; on-chip buffers; post-silicon validation; real-time visibility; signal tracing; Circuit testing; Computer bugs; Costs; Fabrics; Hardware; Integrated circuit interconnections; Multiplexing; Signal analysis; Signal design; Signal processing; Post-Silicon Validation; Trace-Based Debug;
Conference_Titel :
Design Automation Conference, 2009. DAC '09. 46th ACM/IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-6055-8497-3