DocumentCode :
500944
Title :
Optimizing throughput of power- and thermal-constrained multicore processors using DVFS and per-core power-gating
Author :
Lee, Jungseob ; Kim, Nam Sung
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Wisconsin - Madison, Madison, WI, USA
fYear :
2009
fDate :
26-31 July 2009
Firstpage :
47
Lastpage :
50
Abstract :
Process variability from a range of sources is growing as technology scales below 65 nm, resulting in increasingly nonuniform transistor delay and leakage power both within a die and across dies. As a result, the negative impact of process variations on the maximum operating frequency and the total power consumption of a processor is expected to worsen. Meanwhile, manufacturers have integrated more cores in a single die, substantially improving the throughput of a processor running highly-parallel applications. However, many existing applications do not have high enough parallelism to exploit multiple cores in a die. In this paper, first, we analyze the throughput impact of applying per-core power gating and dynamic voltage and frequency scaling to power- and thermal-constrained multicore processors. To optimize the throughput of the multicore processors running applications with limited parallelism, we exploit power- and thermal-headroom resulted from power-gated idle cores, allowing active cores to increase operating frequency through supply voltage scaling. Our analysis using a 32 nm predictive technology model shows that optimizing the number of active cores and operating frequency within power, thermal, and supply voltage scaling limits improves the throughput of a 16-core processor by ~16%. Furthermore, we extend our throughput analysis and optimization to consider the impact of within-die process variations leading to core-to-core frequency (and leakage power) variations in a multicore processor. Our analysis shows that exploiting core-to-core frequency variations improves the throughput of a 16-core processor by ~75%.
Keywords :
microprocessor chips; multiprocessing systems; power aware computing; DVFS; dynamic frequency scaling; dynamic voltage scaling; leakage power; maximum operating frequency; nonuniform transistor delay; parallel application; per-core power-gating; power consumption; process variability; thermal-constrained multicore processor; Analytical models; Delay; Dynamic voltage scaling; Frequency; Manufacturing processes; Multicore processing; Parallel processing; Permission; Process design; Throughput; DVFS; multicore processor; power gating;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2009. DAC '09. 46th ACM/IEEE
Conference_Location :
San Francisco, CA
ISSN :
0738-100X
Print_ISBN :
978-1-6055-8497-3
Type :
conf
Filename :
5227202
Link To Document :
بازگشت