DocumentCode
50127
Title
Experimental Study of Gate-First FinFET Threshold-Voltage Mismatch
Author
Qintao Zhang ; Wang, Chingyue ; Hailing Wang ; Schnabel, Christian ; Dae-Gyu Park ; Springer, Scott K. ; Leobandung, Effendi
Author_Institution
IBM Microelectron. Div., Semicond. R&D Center, Hopewell Junction, NY, USA
Volume
61
Issue
2
fYear
2014
fDate
Feb. 2014
Firstpage
643
Lastpage
646
Abstract
In this brief, threshold voltage mismatch of fully integrated n-type FinFETs based on a gate-first process was studied experimentally. Significantly improved threshold voltage mismatch due to undoped FIN body was confirmed with the experimental data. By comparing mismatch values of thin- and thick-oxide nMOS, we found that factors, which do not scale with gate oxide thickness, including line edge roughness and metal-gate granularity (MGG), can explain ~ 60% of total mismatch of thin-oxide devices. Moreover, we report a convex shape of threshold voltage mismatch following the increase of the number of FINs and propose a possible explanation of the abnormal behavior. Due to channel width quantization, two competing contributors impact mismatch: as FIN number becomes smaller mismatch due to MGG likely play an important role which increases threshold voltage mismatch, whereas FIN number becomes larger, systematic variation becomes the main factor, which also increases threshold voltage mismatch.
Keywords
MOSFET; FIN number; MGG; fully integrated n-type FinFET; gate-first process; line edge roughness; metal-gate granularity; thick-oxide nMOS; thin-oxide nMOS; threshold-voltage mismatch; Educational institutions; FinFETs; Logic gates; Metals; Threshold voltage; FinFET; gate first; high- $k$ metal gate; mismatch;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2013.2295715
Filename
6704319
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