• DocumentCode
    50127
  • Title

    Experimental Study of Gate-First FinFET Threshold-Voltage Mismatch

  • Author

    Qintao Zhang ; Wang, Chingyue ; Hailing Wang ; Schnabel, Christian ; Dae-Gyu Park ; Springer, Scott K. ; Leobandung, Effendi

  • Author_Institution
    IBM Microelectron. Div., Semicond. R&D Center, Hopewell Junction, NY, USA
  • Volume
    61
  • Issue
    2
  • fYear
    2014
  • fDate
    Feb. 2014
  • Firstpage
    643
  • Lastpage
    646
  • Abstract
    In this brief, threshold voltage mismatch of fully integrated n-type FinFETs based on a gate-first process was studied experimentally. Significantly improved threshold voltage mismatch due to undoped FIN body was confirmed with the experimental data. By comparing mismatch values of thin- and thick-oxide nMOS, we found that factors, which do not scale with gate oxide thickness, including line edge roughness and metal-gate granularity (MGG), can explain ~ 60% of total mismatch of thin-oxide devices. Moreover, we report a convex shape of threshold voltage mismatch following the increase of the number of FINs and propose a possible explanation of the abnormal behavior. Due to channel width quantization, two competing contributors impact mismatch: as FIN number becomes smaller mismatch due to MGG likely play an important role which increases threshold voltage mismatch, whereas FIN number becomes larger, systematic variation becomes the main factor, which also increases threshold voltage mismatch.
  • Keywords
    MOSFET; FIN number; MGG; fully integrated n-type FinFET; gate-first process; line edge roughness; metal-gate granularity; thick-oxide nMOS; thin-oxide nMOS; threshold-voltage mismatch; Educational institutions; FinFETs; Logic gates; Metals; Threshold voltage; FinFET; gate first; high- $k$ metal gate; mismatch;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2295715
  • Filename
    6704319