DocumentCode :
50127
Title :
Experimental Study of Gate-First FinFET Threshold-Voltage Mismatch
Author :
Qintao Zhang ; Wang, Chingyue ; Hailing Wang ; Schnabel, Christian ; Dae-Gyu Park ; Springer, Scott K. ; Leobandung, Effendi
Author_Institution :
IBM Microelectron. Div., Semicond. R&D Center, Hopewell Junction, NY, USA
Volume :
61
Issue :
2
fYear :
2014
fDate :
Feb. 2014
Firstpage :
643
Lastpage :
646
Abstract :
In this brief, threshold voltage mismatch of fully integrated n-type FinFETs based on a gate-first process was studied experimentally. Significantly improved threshold voltage mismatch due to undoped FIN body was confirmed with the experimental data. By comparing mismatch values of thin- and thick-oxide nMOS, we found that factors, which do not scale with gate oxide thickness, including line edge roughness and metal-gate granularity (MGG), can explain ~ 60% of total mismatch of thin-oxide devices. Moreover, we report a convex shape of threshold voltage mismatch following the increase of the number of FINs and propose a possible explanation of the abnormal behavior. Due to channel width quantization, two competing contributors impact mismatch: as FIN number becomes smaller mismatch due to MGG likely play an important role which increases threshold voltage mismatch, whereas FIN number becomes larger, systematic variation becomes the main factor, which also increases threshold voltage mismatch.
Keywords :
MOSFET; FIN number; MGG; fully integrated n-type FinFET; gate-first process; line edge roughness; metal-gate granularity; thick-oxide nMOS; thin-oxide nMOS; threshold-voltage mismatch; Educational institutions; FinFETs; Logic gates; Metals; Threshold voltage; FinFET; gate first; high- $k$ metal gate; mismatch;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2295715
Filename :
6704319
Link To Document :
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