DocumentCode :
501290
Title :
Numerical Simulation and Visualization of Thermal and Flow Fields of MOCVD
Author :
Tao, Yu ; Guihua, Hu ; Wenhua, Zhu ; Hu Xiaomei
Author_Institution :
CIMS & Robot Center, Shanghai Univ., Shanghai, China
Volume :
2
fYear :
2009
fDate :
15-17 May 2009
Firstpage :
749
Lastpage :
754
Abstract :
Method of computational fluid dynamics (CFD) was applied to numerical simulation of gases´ thermal and flow fields of metal organic chemical vapor deposition (MOCVD) reactor which grows high efficiency three junction GaInP/GaAs/Ge tandem solar cells. Virtual reality (VR) technology was applied to visualization of numerical simulation of gas´s thermal and flow fields of MOCVD reactor. The results of numerical simulation provide optimization of processing parameters in MOCVD reactor under a certain conditions, providing rational suggestion for optimization design in size of the substrate in the reactor. The results of visualization truly and intuitively display distributing situation of gas´s temperature field and velocity field in MOCVD reactor, providing further optimizations of processing parameters of GaInP thin film grown by MOCVD with theoretical basis.
Keywords :
chemical reactors; chemical vapour deposition; computational fluid dynamics; numerical analysis; optimisation; organic compounds; solar cells; thin films; virtual reality; CFD method; GaAs; GaInP; Ge; computational fluid dynamics; flow field; metal organic chemical vapor deposition reactor; numerical simulation; processing parameter optimization; solar cell; thin film; virtual reality; Chemical vapor deposition; Computational fluid dynamics; Design optimization; Gases; Inductors; MOCVD; Numerical simulation; Organic chemicals; Virtual reality; Visualization; Computational Fluid Dynamics; Metal Organic Chemical Vapor Deposition; Virtual Reality technology; optimization; processing parameters; visualization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Information Technology and Applications, 2009. IFITA '09. International Forum on
Conference_Location :
Chengdu
Print_ISBN :
978-0-7695-3600-2
Type :
conf
DOI :
10.1109/IFITA.2009.35
Filename :
5231473
Link To Document :
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