DocumentCode :
501679
Title :
ESIDE: An Integrated Development Environment for Component-Based Embedded Systems
Author :
Pilkington, Nicholas T. ; Li, Juncao ; Xie, Fei
Author_Institution :
Dept. of Comput. Sci., Portland State Univ., Portland, OR, USA
Volume :
1
fYear :
2009
fDate :
20-24 July 2009
Firstpage :
305
Lastpage :
314
Abstract :
In this paper we present ESIDE, an integrated development environment for component-based embedded systems. It leverages component-based software engineering principles to facilitate efficient, scalable, and robust hardware/software co-design, co-simulation, co-verification, and their seamless integration. We first describe the architecture and features of ESIDE. We then discuss several design decisions that we faced in developing ESIDE and the trade-offs in making these decisions. To provide perspective, we report our experiences in re-engineering TinyOS-based networked sensor systems into complete component-based designs that cover both hardware and software.
Keywords :
decision making; digital simulation; embedded systems; formal specification; hardware-software codesign; object-oriented programming; operating systems (computers); program verification; software architecture; systems re-engineering; ESIDE; TinyOS-based networked sensor system; co-simulation environment; co-verification; component-based architecture specification; component-based software engineering principle; decision making; embedded system integrated development environment; hardware/software co-design; software re-engineering; Application software; Computer architecture; Costs; Embedded computing; Embedded software; Embedded system; Hardware; Manufacturing; Sensor systems; Software reusability; Co-Simulation; Co-Synthesis; Co-Verification; Component-Based Development; Embedded Architecture Description Language; Embedded Systems; Hardware/Software Co-Design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Software and Applications Conference, 2009. COMPSAC '09. 33rd Annual IEEE International
Conference_Location :
Seattle, WA
ISSN :
0730-3157
Print_ISBN :
978-0-7695-3726-9
Type :
conf
DOI :
10.1109/COMPSAC.2009.48
Filename :
5254247
Link To Document :
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