• DocumentCode
    501863
  • Title

    Integration of TLP analysis for ESD troubleshooting

  • Author

    Ting, Li-Moum ; Duvvury, Charvaka ; Trevino, O. ; Schichl, Joe ; Diep, Tom

  • Author_Institution
    MAKE Quality & Reliability Eng., Texas Instrum., Dallas, TX, USA
  • fYear
    2001
  • fDate
    11-13 Sept. 2001
  • Firstpage
    440
  • Lastpage
    447
  • Abstract
    In the present work, we have integrated TLP analysis into our troubleshooting efforts for product-level ESD protection designs. We have demonstrated the application of the TLP analysis to understand a unique HBM ESD failure and to arrive at the necessary corrective actions to optimize the product ESD design.
  • Keywords
    electrostatic discharge; failure analysis; transmission lines; ESD troubleshooting; PMOS structures; human body model ESD failure; transmission line pulsing; Electrostatic discharge; Leakage current; Oscilloscopes; Packaging; Product design; Protection; Stress; Testing; Transistors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2001. EOS/ESD '01.
  • Conference_Location
    Portland, OR
  • Print_ISBN
    978-1-5853-7039-9
  • Electronic_ISBN
    978-1-5853-7039-9
  • Type

    conf

  • Filename
    5254931
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=501863