DocumentCode :
501881
Title :
Wafer charging evaluation method of ion milling in GMR head manufacturing using antenna test element group
Author :
Kakuta, Shigeru ; Taniguchi, Hitoshi ; Kondo, Akira ; Ikeda, Hidehiro ; Furusawa, Kenji ; Todoroki, Satoru
Author_Institution :
Production Eng. Res. Lab., Hitachi Ltd., Yokohama, Japan
fYear :
2001
fDate :
11-13 Sept. 2001
Firstpage :
304
Lastpage :
308
Abstract :
An antenna test element group (TEG), used for the evaluation of wafer charging in semiconductor fabrication, is applied to ion milling in the fabrication of GMR heads. The antenna TEG can quantitatively evaluate the potential for ESD damage to the GMR heads. The differences between thermal electron and microwave plasma neutralization are discussed.
Keywords :
antennas; electrostatic discharge; giant magnetoresistance; magnetic heads; milling; ESD damage; GMR head manufacturing; antenna test element group; ion milling; microwave plasma neutralization; semiconductor fabrication; thermal electron; wafer charging evaluation method; Consumer electronics; Electronic mail; Electrostatic discharge; GSM; Manufacturing; Milling; Multiaccess communication; Radio frequency; Telephone sets; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2001. EOS/ESD '01.
Conference_Location :
Portland, OR
Print_ISBN :
978-1-5853-7039-9
Electronic_ISBN :
978-1-5853-7039-9
Type :
conf
Filename :
5254952
Link To Document :
بازگشت