Title :
Electronic part damage by antistat vapor
Author :
Kolyer, J.M. ; Passchier, A.A. ; Peterson, W.G.
Author_Institution :
Boeing Co., Anaheim, CA, USA
Abstract :
By a subtle, unexpected mechanism, open devices stored in antistatic plastic containers were destroyed by micrometer-scale droplets of diethanolamide antistat (identified by infrared spectrum) deposited from the vapor. These hygroscopic surfactant droplets absorbed atmospheric moisture, penetrated interstices, and corroded thin metal oxide layers. The process was modeled with sputtered metals on slides. Since any organic container can outgas, storage of corrosion-sensitive open devices in glass is recommended.
Keywords :
containers; electronics packaging; glass; moisture; plastic products; surfactants; antistat vapor; antistatic plastic container; atmospheric moisture; corrosion-sensitive open device; diethanolamide antistat; electronic part damage; glass; hygroscopic surfactant droplet; infrared spectrum; micrometer scale droplet; open devices; organic container; penetrated interstices; sputtered metal; thin metal oxide layer; Chemical vapor deposition; Containers; Contamination; Glass; Humidity; Infrared spectra; Moisture; Plastic products; Polyethylene; Temperature;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2001. EOS/ESD '01.
Conference_Location :
Portland, OR
Print_ISBN :
978-1-5853-7039-9
Electronic_ISBN :
978-1-5853-7039-9
