Electronic part damage by antistat vapor

Author

Kolyer, J.M. ; Passchier, A.A. ; Peterson, W.G.

Author_Institution

Boeing Co., Anaheim, CA, USA

fYear

2001

fDate

11-13 Sept. 2001

Firstpage

270

Lastpage

278

Abstract

By a subtle, unexpected mechanism, open devices stored in antistatic plastic containers were destroyed by micrometer-scale droplets of diethanolamide antistat (identified by infrared spectrum) deposited from the vapor. These hygroscopic surfactant droplets absorbed atmospheric moisture, penetrated interstices, and corroded thin metal oxide layers. The process was modeled with sputtered metals on slides. Since any organic container can outgas, storage of corrosion-sensitive open devices in glass is recommended.

Keywords

containers; electronics packaging; glass; moisture; plastic products; surfactants; antistat vapor; antistatic plastic container; atmospheric moisture; corrosion-sensitive open device; diethanolamide antistat; electronic part damage; glass; hygroscopic surfactant droplet; infrared spectrum; micrometer scale droplet; open devices; organic container; penetrated interstices; sputtered metal; thin metal oxide layer; Chemical vapor deposition; Containers; Contamination; Glass; Humidity; Infrared spectra; Moisture; Plastic products; Polyethylene; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Overstress/Electrostatic Discharge Symposium, 2001. EOS/ESD '01.

Conference_Location

Portland, OR

Print_ISBN

978-1-5853-7039-9

Electronic_ISBN

978-1-5853-7039-9

Type

conf

Filename

5254958