Preparing a microelectronics assembly and test area for more sensitive product

In anticipation of bringing a more sensitive product (< 50 V MM and HBM damage threshold) into a microelectronics area, audits were performed on the equipment, materials and processes in the area. First, the ESD sensitivity of the product was determined. Then, using an electrometer, static event detectors and test articles, tests were performed to identify high-risk materials and processes. These included ball bonding, laser welding and bench-to-oven transport. Several modifications to equipment and materials were necessary to reduce the risk for ESD damage to the product. This paper summarizes the test methods, findings, and recommendations for improvement.