• DocumentCode
    501908
  • Title

    Controlling ESD damage of ICs at various steps of back-end process

  • Author

    Marley, John ; Tan, David ; Kraz, Vladimir

  • Author_Institution
    Xilinx, Inc., San Jose, CA, USA
  • fYear
    2001
  • fDate
    11-13 Sept. 2001
  • Firstpage
    119
  • Lastpage
    123
  • Abstract
    In this work we study the methodology of ESD Event identification and their correlation with operation of equipment at various stages of the back end IC manufacturing. Survey of ESD environment in terms of exposure of ICs to known strength of ESD Events is described. Such correlation is instrumental in identification of sources of ESD damage and in setting up and maintaining ESD-safe environment.
  • Keywords
    electrostatic discharge; integrated circuit manufacture; occupational safety; ESD Event identification; ESD damage control; ESD-safe environment; back end IC manufacturing; electrostatic discharge; Costs; Electrostatic discharge; Energy measurement; Fault location; Logic; Manufacturing; Pins; Protection; Pulse measurements; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2001. EOS/ESD '01.
  • Conference_Location
    Portland, OR
  • Print_ISBN
    978-1-5853-7039-9
  • Electronic_ISBN
    978-1-5853-7039-9
  • Type

    conf

  • Filename
    5254981
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=501908