Title :
ESD damage due to HBM stressing of non-connected pins
Author :
Kaschani, K.T. ; Schimon, M. ; Hofmann, M. ; Wilson, M.W. ; Koch, A.
Author_Institution :
Atmel Germany GmbH, Heilbronn, Germany
Abstract :
An ESD damage due to HBM stressing of a non-connected pin is introduced. The failure mechanism is investigated and discussed. As a result, four different possible sources for a sparkover between non-connected and regular pins are introduced. Finally, possible countermeasures are discussed and recommendations are given to avoid similar failures.
Keywords :
automotive electronics; electrostatic discharge; failure analysis; integrated circuit design; ESD damage; HBM stressing; automotive applications; failure mechanism; integrated circuit design; nonconnected pins; Application specific integrated circuits; Current measurement; Electrostatic discharge; Failure analysis; Packaging; Pins; Protection; Stress; Testing; Voltage;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2006. EOS/ESD '06.
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-5853-7115-0
