• DocumentCode
    502983
  • Title

    Implementation of high VT turn-on in low-voltage SCR devices

  • Author

    Vashchenko, V.A. ; Lindorfer, P. ; Hopper, P.

  • Author_Institution
    Nat. Semicond. Corp., Santa Clara, CA, USA
  • fYear
    2005
  • fDate
    8-16 Sept. 2005
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A novel design approach for low-voltage ESD protection clamps is suggested based on the use of free pseudo high threshold voltage SCR structures. The method is experimentally validated for a 0.18 mum 1.8 V/5 V dual gate oxide CMOS process where free high threshold voltage (VT) LVTSCR and Drain extended NMOS-SCR structures were formed by combining the thick 120 A gate oxide used for 5 V devices with additional low voltage PWELL through poly implants used for the 1.8 V devices. The physical mechanism of the forming of pseudo high VT characteristics is explained by means of numerical simulation. Low-voltage pulsed turn-on and turn-off characteristics have been demonstrated under low DC leakage of the devices.
  • Keywords
    CMOS integrated circuits; electrostatic discharge; low-power electronics; thyristors; DC leakage; ESD protection clamps; current 120 A; drain extended NMOS-SCR structures; dual gate oxide CMOS process; low-voltage SCR device; low-voltage pulsed turn-on characteristics; poly implants; pseudo high threshold voltage SCR structures; size 0.18 mum; turn-off effect; voltage 1.8 V; voltage 5 V; Circuits; Clamps; Conductivity; Electrostatic discharge; Implants; Low voltage; MOS devices; Protection; Threshold voltage; Thyristors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2005. EOS/ESD '05.
  • Conference_Location
    Tucson, AZ
  • Print_ISBN
    978-1-58537-069-6
  • Electronic_ISBN
    978-1-58537-069-6
  • Type

    conf

  • Filename
    5271738