Title :
A second ESD threat for ESD sensitive devices with copper leads
Author :
Koike, Shirou ; Soda, Yutaka ; Honda, Masamitsu
Author_Institution :
Tokyo Electron. Trading Co., Ltd., Tachikawa, Japan
Abstract :
We investigated the primary ESD event from a small air-gap discharge and induced voltage as the second ESD threat at an ESD sensitive (ESDS) device with copper leads. The discharge current waveform of the primary ESD event caused by air-gap discharge was measured at 50 mum gap width. The induced voltage in copper lead was measured versus length and width. Voltages between 3.4 V and 7.2 V were measured, which indicate an enough ESD threat to ESDS devices from the secondary event.
Keywords :
copper; electrostatic discharge; integrated circuit testing; printed circuit testing; semiconductor device breakdown; Cu; ESD sensitive device; PCB patterns; air-gap discharge; copper leads; discharge current waveform; induced voltage; primary ESD event; Air gaps; Copper; Current measurement; Electrostatic discharge; Fault location; Insulation; Magnetic field measurement; Magnetic heads; Probes; Voltage;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2005. EOS/ESD '05.
Conference_Location :
Tucson, AZ
Print_ISBN :
978-1-58537-069-6
Electronic_ISBN :
978-1-58537-069-6