• DocumentCode
    502992
  • Title

    A study of esd damage to a device inside a metal enclosure

  • Author

    Wallash, Albert

  • Author_Institution
    Hitachi Global Storage Technol., San Jose, CA, USA
  • fYear
    2005
  • fDate
    8-16 Sept. 2005
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    The ESD immunity of a system consisting of a metal box with an ESD sensitive device that is coupled to the inside and outside of the box is studied experimentally and through SPICE and 3D electromagnetic simulations. It is found that the combination of wire feedthroughs and an impedance imbalance across the terminals of the device results in significant current flow through the device. It is concluded that simulations combined with experimental measurements open up the possibility of predicting the ESD immunity of a system containing an extremely ESD sensitive device.
  • Keywords
    SPICE; electrostatic discharge; 3D electromagnetic simulations; ESD damage; ESD sensitive device; SPICE; metal enclosure; Circuit testing; Coupling circuits; Electromagnetic coupling; Electromagnetic measurements; Electrostatic discharge; Insulation; Preamplifiers; Printed circuits; SPICE; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2005. EOS/ESD '05.
  • Conference_Location
    Tucson, AZ
  • Print_ISBN
    978-1-58537-069-6
  • Electronic_ISBN
    978-1-58537-069-6
  • Type

    conf

  • Filename
    5271747