DocumentCode
502992
Title
A study of esd damage to a device inside a metal enclosure
Author
Wallash, Albert
Author_Institution
Hitachi Global Storage Technol., San Jose, CA, USA
fYear
2005
fDate
8-16 Sept. 2005
Firstpage
1
Lastpage
9
Abstract
The ESD immunity of a system consisting of a metal box with an ESD sensitive device that is coupled to the inside and outside of the box is studied experimentally and through SPICE and 3D electromagnetic simulations. It is found that the combination of wire feedthroughs and an impedance imbalance across the terminals of the device results in significant current flow through the device. It is concluded that simulations combined with experimental measurements open up the possibility of predicting the ESD immunity of a system containing an extremely ESD sensitive device.
Keywords
SPICE; electrostatic discharge; 3D electromagnetic simulations; ESD damage; ESD sensitive device; SPICE; metal enclosure; Circuit testing; Coupling circuits; Electromagnetic coupling; Electromagnetic measurements; Electrostatic discharge; Insulation; Preamplifiers; Printed circuits; SPICE; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium, 2005. EOS/ESD '05.
Conference_Location
Tucson, AZ
Print_ISBN
978-1-58537-069-6
Electronic_ISBN
978-1-58537-069-6
Type
conf
Filename
5271747
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