ESD control in automated placement process

Author

Paasi, Jaakko ; Tamminen, Pasi ; Salmela, Hannu ; Leskinen, Jari-Pekka ; Viheriäkoski, Toni

Author_Institution

VTT Tech. Res. Centre of Finland, Tampere, Finland

fYear

2005

fDate

8-16 Sept. 2005

Firstpage

1

Lastpage

9

Abstract

ESD control in automated placement process has been studied. New principles for placement equipment design, going beyond those given in ANSI/ESD S20.20 and ESD SP10.1, are suggested. In analogy to ESD packaging materials, three classes of parts, materials and surfaces in an AHE are defined: intimate, proximity, and secondary equipment parts, materials and surfaces. Methods for the evaluation of ESD safety are presented, and an example of ESD safety evaluation of placement process, applying the measurement of real discharge current waveforms of devices being processed, is given.

Keywords

electronic equipment manufacture; electronics packaging; electrostatic discharge; ANSI/ESD S20.20; ESD SP10.1; ESD control; automated placement process; discharge current waveforms; packaging materials; placement equipment design; Automatic control; Biological system modeling; Circuit testing; Conducting materials; Current measurement; Electronic equipment manufacture; Electrostatic discharge; Measurement standards; Safety devices; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Overstress/Electrostatic Discharge Symposium, 2005. EOS/ESD '05.

Conference_Location

Tucson, AZ

Print_ISBN

978-1-58537-069-6

Electronic_ISBN

978-1-58537-069-6

Type

conf

Filename

5271762