• DocumentCode
    503008
  • Title

    Impact of the CDM tester ground plane capacitance on the DUT stress level

  • Author

    Goeau, Cédric ; Richier, Corinne ; Salomé, Pascal ; Chante, Jean-Pierre ; Jaouen, Hervé

  • Author_Institution
    STMicroelectronics, Crolles, France
  • fYear
    2005
  • fDate
    8-16 Sept. 2005
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    The CDM ground plane capacitance CGP is a key parameter for the tester modeling. From a test point of view, we show that the CDM test result depends on CGP, and thus of all parameters which influence it, like the ground plane size or the DUT package thickness. Then from a simulation point of view, we have to take into account CGP since this value defines the right voltage stress applied on the simulated circuit.
  • Keywords
    circuit simulation; electrostatic discharge; integrated circuit testing; CDM tester ground plane capacitance; DUT stress level; circuit simulation; tester modeling; Capacitance; Costs; Electrostatic discharge; IEC standards; Microelectronics; Performance evaluation; Pins; Power supplies; Stress; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2005. EOS/ESD '05.
  • Conference_Location
    Tucson, AZ
  • Print_ISBN
    978-1-58537-069-6
  • Electronic_ISBN
    978-1-58537-069-6
  • Type

    conf

  • Filename
    5271765